The LED package will move in two directions: one is horizontal and vertical integration, and the second is continuously extended downstream.
Before the LED chip emits light, it needs to be protected by the packaging technology. The development trend of high-brightness LED is benefited from each generation of packaging materials.
The choice of LED packaging methods, materials, structures, and processes is primarily determined by factors such as chip structure, optoelectronic/mechanical characteristics, specific applications, and cost. After more than 40 years of development, LED packaging has experienced the development stages of stent (LampLED), SMD (SMDLED), and power LED (PowerLED).
With the increase of chip power, especially the development of solid-state lighting technology, new and higher requirements are put forward for the optical, thermal, electrical and mechanical structures of LED packages. In order to effectively reduce the thermal resistance of the package and improve the light extraction efficiency, a new technical idea must be adopted for the package design.
However, at present, the packaging companies in the middle reaches of the LED industry are struggling under the pressure of upstream and downstream. While the cost of packaging products is decreasing, the sales price is also declining accordingly.
A number of industry insiders told reporters that the package will move in two directions: first, horizontal and vertical integration, and secondly, extending downstream.
The function of the product technology package is to provide sufficient protection for the chip to prevent the chip from being exposed to long-term exposure or mechanical damage in the air to improve the stability of the chip. For the LED package, it is also required to have good light extraction efficiency and good heat dissipation. The package allows the LED to have better luminous efficiency and heat dissipation environment, thereby increasing the life of the LED.
At present, the packaging materials have been mirror-finished from the first generation of PPA pre-molding frame resin/mirror to the second-generation ceramic substrate. Until now, the third generation of high-reflective materials pre-packaged substrate resin/mirror surface is the current hot EMC material. The trend of high-brightness LEDs has benefited from every generation of packaging materials. The third generation of packaged devices can achieve large-scale production, reduce cost, design flexibility, and smaller size design, which is in line with the trend of thin, high integration and small volume of LED products.
At present, the current development of the domestic LED packaging industry has been relatively mature, forming a complete LED packaging industry chain. In terms of regional distribution, the Pearl River Delta region is the region with the largest concentration of LED packaging enterprises in China and the largest packaging industry. The number of enterprises exceeds 2/3 of the national total, accounting for 68% of the total number of enterprises in the country, except for the lack of upstream LED epitaxial chips. In addition, a large number of packaging materials and packaging equipment manufacturers and agents, the most complete supporting. Followed by the Yangtze River Delta region, the number of enterprises accounted for about 17 of the country, and the other regions accounted for 15%.
Relevant data show that in 2012, the total output value of domestic LED packaging reached 43.8 billion yuan, an increase of 53.68 compared with 2011, of which Guangdong Province's output value reached 32.3 billion yuan, an increase of 57.56, accounting for 73.74 of the total output value of domestic LED packaging. The middle package encapsulated 47.3 billion yuan, a year-on-year increase of 19. It is expected to reach 13.39 billion US dollars in 2014, with an annual growth rate of 7.
Although China's LED packaging industry has a considerable economic scale, accounting for about 70% of the global LED packaging production, this proportion will further increase in the future. The number of LED packaging companies in China has exceeded 2,000, but there is no packaging giant in mainland China as a major packaging country. In contrast, the top five global LED packaging manufacturers are Nichia, Cree, Philips, Samsung and Taiwan Everlight. Among them, Taiwanese manufacturer Yiguang focuses on packaging and is the leader of SMDLED packaging industry. It is also LG, Sharp and Samsung. The main supplier of LED LCD TV manufacturers.
In addition to Ruifeng Optoelectronics' focus on LED packaging, other companies in the domestic LED packaging application sector are cutting into the LED lighting market. Among them, Hongli Optoelectronics attaches great importance to technology and attaches importance to marketing, mainly developing LED lighting field; Ruifeng Optoelectronics pursues technology leadership, focusing on LED packaging, mainly developing LED lighting devices and LED backlight devices; Lehman Optoelectronics takes packaging as the core and actively Open up the downstream application market; National Star Optoelectronics takes the vertical integration route.
The advantages of domestic mid-stream listed companies on the evening of January 15th, LED packaging company Jingfang Technology IPO was urgently suspended, which led to the market's doubts about the high valuation of Jingfang Technology's reference to six competing companies.
In 2010, the domestic packaging industry took the official landing of the A-share market as a turning point for Guoxing Optoelectronics, setting off a wave of listing.
Up to now, there are 8 listed companies in the main business, including Changfang Semiconductor, Lehman Optoelectronics, Ruifeng Optoelectronics, Jufei Optoelectronics, Wanrun Technology, Hongli Optoelectronics, Guoxing Optoelectronics, Goer Acoustics, among them In addition to Acoustics, the other seven listed companies are located in Guangdong Province, with 5 in Shenzhen and one in Foshan and Guangzhou.
Among the six companies selected by Jingfang Technology, Changfang Lighting, Ruifeng Optoelectronics and Lehman Optoelectronics are also representatives of LED packaging companies in the secondary market.
Secondly, from the analysis of the application field of packaging products, the largest proportion of revenue in the LED lighting field is Hongli Optoelectronics, about 80, followed by Ruifeng Optoelectronics, which is about 53.5. The highest proportion of revenue in the LED backlight field. The Ruifeng Optoelectronics is about 34; most of the rest of the revenue comes from the LED display field.
A brokerage researcher in Shenzhen told reporters that listed companies in the field of LED packaging applications have their own characteristics. Ruifeng Optoelectronics is leading in LED packaging technology, followed by Hongli Optoelectronics; in addition, Lehman Optoelectronics, Chau Ming Technology and Alto Electronics in LED display The screen is technically equivalent.
Ruifeng Optoelectronics has been at the forefront of the domestic ceramic substrate packaging technology, and has obtained invention patents, which has advantages in heat dissipation and other aspects compared to other substrate technologies. In addition, the company has mature technology in single-electrode chip with bottom line package, surface roughening, blue chip to stimulate white phosphor in the phosphor shell. TV-backlit LED products have also matured and are available in volume to mainstream TV manufacturers.
In addition, the highlight of Ruifeng Optoelectronics lies in the force of EMC packaging technology. In the future integration of chips and control circuits, this packaging business may be the first to break the barrier of traditional packaging concepts.
Hongli Optoelectronics is engaged in the packaging of high-end white light and high-power LED devices. The products are mainly used in indoor and outdoor general lighting and automotive signal and lighting fields. The company's core competitiveness lies in high-end white light and high-power LED packaging technology. Unlike ordinary LED packages, white light and high power packages have high technical barriers to light efficiency, color development, stability, and heat dissipation. The company has been focusing on this field, has 4 items and is applying for 11 related invention patents. It is the LED packaging enterprise with the most white patents in China.
Lehman Optoelectronics first made display device packaging. LED display applications are mainly exported, and exported to some developed countries in North America and Europe, while the domestic market share is relatively small. The two main directions are LED full color display package devices and white light package devices.
Lehman Opto's representative 3528 black beauty is compared with the traditional surface brush type 3528SMD, its contrast can be increased by more than 30, the consistency is more prominent, and the display mask can be eliminated; compared with the traditional full black shell type 3528SMD, in brightness Under the same conditions, the power consumption can be saved by 30 due to the proprietary technology of white surface, and the cost of single bead drops by 15T-30 under the same power consumption conditions.
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